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Thermal & Stress Analysis Software

IES's stand-alone thermal and structural packages complement your electromagnetic analysis software. The complete solution of your device uses the electromagnetic power loss or force output as input for the thermal and structural analysis.

2D Coupled Thermal Analysis Software

Explore the full possibilities of time saving, cost-effective product design optimization with Integrated Engineering Software's KELVIN , a 2D/RS stand-alone thermal package. Coupled Analysis, the complete electromagnetic/mechanical solution of a device, is obtained by using the electromagnetic power loss or force output as input for the thermal and structural analysis.
Design engineers depend on KELVIN for coupled thermal / mechanical and electromagnetic applications including:
  • Cooling Fins
  • Heat Sinks
  • Chip Packaging
  • Motor Cooling

3D Coupled Thermal Analysis Software

Explore the full possibilities of time saving, cost-effective product design optimization with Integrated Engineering Software's CELSIUS, a 3D fully functional thermal package. Coupled Analysis, the complete electromagnetic/mechanical solution of a device, is obtained by using the electromagnetic power loss or force output as input for the thermal and structural analysis.

Design engineers depend on KELVIN for coupled thermal / mechanical and electromagnetic applications including:

  • Cooling Fins
  • Heat Sinks
  • Chip Packaging
  • Motor Cooling

2D Coupled Stress Analysis Software

Explore the full possibilities of time saving, cost-effective product design optimization with Integrated Engineering Software's ELASTO, a 2D/RS fully functional structural package, using the same innovative Hybrid BE-FE Method technology as IES's electromagnetic tools. Coupled Analysis, the complete electromagnetic/mechanical solution of a device, is obtained by using the electromagnetic power loss or force output as input for the thermal and structural analysis.
Design engineers depend on ELASTO for mechanical applications including Stress / Strain of mechanical components and systems.

For more information, please download Datasheets (link to product listing page) or visit our principals www.integratedsoft.com/products.

For more details / Trail version contact : sham@amdlsed.com, shuba@amdlsed.com

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